Bulk solder and solder joint properties for lead free 95.5Sn-3.8Ag-0.7Cu solder alloy

Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys

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Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging

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Lead‐free reflow soldering for electronics assembly

Martin Harrison, James H. Vincent, H. Steen · Soldering and Surface Mount Technology · 2001 · 155 citations

Natural Sciences, Materials Engineering, Materials Science +13

Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy

Xu Shi, Wei Zhou, J.H.L. Pang et al. · Journal of Electronic Packaging · 1999 · 153 citations

Natural Sciences, Materials Engineering, Materials Science +13

Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders

Chaosuan Kanchanomai, Yukio MIYASHITA, Yoshiharu MUTOH · Journal of Electronic Materials · 2002 · 142 citations

Natural Sciences, Materials Engineering, Materials Science +11