First observation on the feasibility of scratch formation by pad–particle mixture in CMP process

Chemical mechanical planarization for microelectronics applications

Parshuram B. Zantye, Ashok Kumar, A. K. Sikder · Materials Science and Engineering R Reports · 2004 · 612 citations

Engineering, Materials Engineering, Materials Science +14

Finite element analysis of fluid flows fully coupled with structural interactions

Klaus‐Jürgen Bathe, Hou Zhang, Shanhong Ji · Computers & Structures · 1999 · 240 citations

Engineering, Computational Engineering, Mechanical Engineering +16

Effect of Particle Size of Chemical Mechanical Polishing Slurries for Enhanced Polishing with Minimal Defects

G. Bahar Basim, J. Adler, Uday Mahajan et al. · Journal of The Electrochemical Society · 2000 · 198 citations

Engineering, Chemical Engineering, Materials Science +13

Von Mises Stress in Chemical‐Mechanical Polishing Processes

Duo Wang, J. Lee, Karey Holland et al. · Journal of The Electrochemical Society · 1997 · 173 citations

Natural Sciences, Materials Engineering, Materials Science +13

Polishing pad surface characterisation in chemical mechanical planarisation

John McGrath, Chris Davis · Journal of Materials Processing Technology · 2004 · 130 citations

Engineering, Materials Engineering, Materials Science +11