Hong Jin Kim

Study of the cross contamination effect on post CMP in situ cleaning process

Hong Jin Kim, Girish Bohra, Hyucksoo Yang et al. · Microelectronic Engineering · 2015 · 57 citations

Hazardous Waste, Chemical Engineering, Situ Cleaning Process +9

First observation on the feasibility of scratch formation by pad–particle mixture in CMP process

In-Ha Sung, Hong Jin Kim, Chang-Dong Yeo · Applied Surface Science · 2012 · 35 citations

Materials Science, Pad–particle Mixture, Engineering +11

Secondary-Side LLC Resonant Controller IC With Dynamic PWM Dimming and Dual-Slope Clock Generator for LED Backlight Units

Seong Wha Hong, Hong Jin Kim, Joon-Sung Park et al. · IEEE Transactions on Power Electronics · 2011 · 35 citations

Low-power Electronics, Dual-slope Clock Generator, Electrical Engineering +10

The structure and composition of aluminum wear debris generated by unlubricated sliding in different environments

Hong Jin Kim, S. Karthikeyan, D.A. Rigney · Wear · 2007 · 19 citations

Engineering, Wear Testing, Aluminum Wear Debris +10

Effect of Brush Treatment and Brush Contact Sequence on Cross Contaminated Defects during CMP in-situ Cleaning

Hong Jin Kim · Journal of the Korean Society of Tribologists and Lubrication Engineers · 2015 · 19 citations

Engineering, Mechanical Engineering, Brush Contact Sequence +18