Hong Jin Kim - Concepedia

Author

Hong Jin Kim

GlobalFoundries (United States)ORCID

Also Known As

Hong Jin Kim, Kim, Hong Jin

Publications

381

Citations

H-Index

Concepts

All Affiliations

GlobalFoundries (United States)Samsung (South Korea)The Ohio State University

About

Hong Jin Kim is an author at GlobalFoundries (United States) specializing in engineering, mechanical engineering, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	11	11	247
2	Chemical Engineering	4	4	105
3	Applied Physics	3	3	37
4	Civil Engineering	1	1	19
5	Computer Engineering	1	1	35

Hong Jin Kim

Publications

289

Citations

H-Index

Page 1

	Year	Citations
Study of the cross contamination effect on post CMP in situ cleaning process Hong Jin Kim, Girish Bohra, Hyucksoo Yang, Microelectronic Engineering Hazardous WasteChemical EngineeringSitu Cleaning ProcessEngineeringEnvironmental Engineering	2015	57
First observation on the feasibility of scratch formation by pad–particle mixture in CMP process In-Ha Sung, Hong Jin Kim, Chang-Dong Yeo Applied Surface Science Materials SciencePad–particle MixtureEngineeringMaterial ProcessingMicrofabrication	2012	35
Secondary-Side LLC Resonant Controller IC With Dynamic PWM Dimming and Dual-Slope Clock Generator for LED Backlight Units Seong Wha Hong, Hong Jin Kim, Joon-Sung Park, IEEE Transactions on Power Electronics Low-power ElectronicsDual-slope Clock GeneratorElectrical EngineeringEngineeringLed Detector	2011	35
The structure and composition of aluminum wear debris generated by unlubricated sliding in different environments Hong Jin Kim, S. Karthikeyan, D.A. Rigney Wear EngineeringWear TestingAluminum Wear DebrisWear PreventionMechanical Engineering	2007	19
Effect of Brush Treatment and Brush Contact Sequence on Cross Contaminated Defects during CMP in-situ Cleaning Hong Jin Kim Journal of the Korean Society of Tribologists and Lubrication Engineers EngineeringMechanical EngineeringBrush Contact SequenceChemical EngineeringCmp Tool	2015	19
Effect of pad surface roughness on material removal rate in chemical mechanical polishing using ultrafine colloidal ceria slurry Sol Han, Hong Jin Kim, Myung Ki Hong, Electronic Materials Letters Materials ScienceChemical EngineeringEngineeringMaterial ProcessingMechanical Engineering	2013	18
Structure and chemical analysis of aluminum wear debris: Experiments and ab initio simulations Hong Jin Kim, Wolfgang Windl, D.A. Rigney Acta Materialia Materials ScienceEngineeringChemical AnalysisWear TestingCorrosion	2007	16
Effect of Controlling Abrasive Size in Slurry for Tungsten Contact CMP Process Bryan Egan, Hong Jin Kim ECS Journal of Solid State Science and Technology Tungsten Contact CmpEngineeringMechanical EngineeringBulk Tungsten SlurryAbrasive Process	2019	15
Understanding and mitigating temperature-induced agglomeration in silica-based chemical mechanical planarization (CMP) slurry storage Ali Othman, Hong Jin Kim, Rahul Trivedi, Colloids and Surfaces A Physicochemical and Engineering Aspects	2024	12
Nano-Scale Stick-Slip Friction Model for the Chatter Scratch Generated by Chemical Mechanical Polishing Process Hong Jin Kim, Ji Chul Yang, Bo Un Yoon, Journal of Nanoscience and Nanotechnology EngineeringMechanical EngineeringNanotribologyFriction ControlMechanics	2012	11

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