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High-Temperature Stable $\hbox{Ir}_{x}\hbox{Si}$ Gates With High Work Function on HfSiON p-MOSFETs
11
Citations
18
References
2007
Year
SemiconductorsMaterials EngineeringElectrical EngineeringGood Hole MobilitiesDegc Thermal StabilityEngineeringPhysicsCrystalline DefectsHigh-temperature StableSemiconductor TechnologyApplied PhysicsHfsion P-mosfetsSemiconductor Device FabricationIntegrated CircuitsHigh Work FunctionMicroelectronicsNovel 1000Semiconductor Device
A novel 1000 degC-stable Ir <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</sub> Si gate on HfSiON is shown for the first time with full process compatibility to current very-large-scale-integration fabrication lines and proper effective work function of 4.95 eV at 1.6-nm equivalent-oxide thickness. In addition, small threshold voltages and good hole mobilities are measured in Ir <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</sub> Si/HfSiON transistors. The 1000 degC thermal stability above pure metal (900 degC only) is due to the inserted 5-nm amorphous Si, which also gives less Fermi-level pinning by the accumulated metallic full silicidation at the interface
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