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Re-examination of indium implantation for a low power 0.1 μm technology
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2002
Year
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EngineeringμM TechnologyWireless Implantable DeviceLow Power 0.1Semiconductor DeviceNmos Channel DopingSims MeasurementsNanoelectronicsElectronic EngineeringElectronic PackagingElectrical EngineeringChannel DopingPhysicsBias Temperature InstabilityIndium ImplantationSemiconductor Device FabricationImplantable DeviceMicroelectronicsLow-power ElectronicsApplied Physics
The use of indium for NMOS channel doping in a 0.1 /spl mu/m CMOS technology is fully re-considered. For the first time, we clearly demonstrate that the room temperature carrier freeze-out is responsible for large discrepancies between spreading resistance and SIMS measurements but that it does not affect Indium doped NMOSFET's operation. 0.1 /spl mu/m NMOS transistors have been fabricated using Indium for channel doping. A strong reduction in short channel effect and a slight improvement in the effective low-field mobility have been obtained.