IEEE Electron Device Letters · 2009 · 34 citations · 15 references
EngineeringMaterials EngineeringMaterials ScienceHeat TransferNanomaterialsThermal AnalysisCarbon NanomaterialsCarbon NanotubesDevice SimulationHeat ConductionHeat Transfer ModelingThermal Properties Of MaterialsBreakdown SimulationCarbon NanofibersElectrothermal ModelingElectrothermal SimulationHeat DissipationHeat TransportThermal Properties Of Carbon Nanomaterials
To elucidate the observed current capacity behavior, a model is developed that takes into account heat transport through the entire carbon nanofiber interconnect test structure and breakdown location. The model also includes variations in contact location with the support material. The resulting predicted heat dissipation and current capacity are completely consistent with experimental data.
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An RF circuit model for carbon nanotubes
Peter J. Burke · IEEE Transactions on Nanotechnology · 2003 · 400 citations · Full text