Electrothermal Analysis of Breakdown in Carbon Nanofiber Interconnects

Toshishige Yamada, Tsutomu Saito, D. Fabris, Cary Y. Yang

IEEE Electron Device Letters · 2009 · 34 citations · 15 references

Concepts

Abstract

To elucidate the observed current capacity behavior, a model is developed that takes into account heat transport through the entire carbon nanofiber interconnect test structure and breakdown location. The model also includes variations in contact location with the support material. The resulting predicted heat dissipation and current capacity are completely consistent with experimental data.

References

15