2002 · 20 citations · 7 references
EngineeringMaterials EngineeringSystems EngineeringMaintenance EngineeringQuality EngineeringSafety EngineeringDevice ReliabilityFailure AnalysisFailure TheoriesReliabilityReliability ModelingReliability-based DesignElectrical ReliabilityEquipment ReliabilityEquipment Reliability EngineeringHermetic Packaging
This paper describes technical and management aspects of using plastic-encapsulated microcircuits (PEM's) in applications in which military, hermetic microcircuits have traditionally been required. In order to implement the use of PEM's in such applications, it is necessary to re-evaluate the entire system of qualifying, procuring, using, and ensuring reliability of parts, and of the products in which they are used. Technically, the disciplines of reliability, accelerated testing, design of experiments, and physics of failure must be used as a comprehensive set of tools to implement and manage the use of PEM's. Finally, an effective and efficient system for collecting and analyzing data must be set up to provide information for rational decision-making.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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Comprehensive Model for Humidity Testing Correlation
D. S. Peck · Reliability physics · 1986 · 198 citations
Comprehensive model for humidity testing correlation
Microelectronics Reliability · 1987 · 160 citations
Lloyd W. Condra, S. O'Rear, Toby Freedman et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1992 · 41 citations