A self-aligned cobalt silicide technology using rapid thermal processing

Abstract

The feasibility of a self-aligned silicide technology based upon cobalt has been investigated. Silicidation reactions were performed by means of rapid thermal processing. Phase sequence, layer morphology, and reaction kinetics were studied by XRD, SEM, RBS, AES, and TEM. Extremely smooth, highly conductive (16 μΩ cm) CoSi2 films were formed by direct reaction of Co on Si, without significant lateral silicide formation at oxide edges. Shallow arsenic junctions were successfully silicided and low contact resistances were obtained on n+ and p+ Si.