Publication | Closed Access
Fundamental limit of gate oxide thickness scaling in advanced MOSFETs
42
Citations
8
References
2000
Year
Device ModelingElectrical EngineeringTunnel ResistanceEngineeringTunneling MicroscopyPhysicsSemiconductor DeviceNanoelectronicsStress-induced Leakage CurrentBias Temperature InstabilityApplied PhysicsTransconductance FluctuationsTechnology ScalingFundamental LimitMicroelectronicsBeyond CmosDirect Tunnel Leakage
The statistical distribution of the direct tunnel leakage current through the ultrathin gate oxides of MOSFETs induces significant fluctuations in the threshold voltage and the transconductance when the gate oxide tunnel resistance becomes comparable to the gate poly-Si resistance. By calculating the measured tunnel current based on multiple scattering theory, it is shown that the threshold voltage and the transconductance fluctuations will be problematic when the gate oxide thickness is scaled down to about 0.8 nm.
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