Powder LSI: an ultra small RF identification chip for individual recognition applications

Abstract

A powder-like 0.09 mm/sup 2/ 2.45 GHz RF identification chip for wireless recognition applications is described. This chip is fabricated in a 0.18 /spl mu/m CMOS process, and its thickness is 60 /spl mu/m. A two-surface connection technique is adopted to facilitate antenna attachment. The distance between the chip and a reader is 300 mm for a reader power of 300 mW.