IEEE Transactions on Electron Devices · 2001 · 74 citations · 15 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsDevice CharacterizationP-n JunctionsSemiconductor Device MaterialsSemiconductor ReliabilityWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsBreakdown VoltageDiode RectifiersGallium Nitride (Gan) MaterialsGallium Nitride Power DevicesJunction BreakdownNegative Temperature CoefficientP-n Junction CharacteristicsTemperature Dependence Of Diodes
The performance of GaN p-i-n and Schottky rectifiers fabricated on the same wafer was investigated as a function of device size and operating temperature. There was a significant difference in reverse breakdown voltage (490 V for p-i-n diodes; 347 V for the Schottky diodes) and forward turn-on voltage (/spl sim/5 V for the p-i-n diodes; /spl sim/3.5 V for the Schottky diodes). Both types of device showed a negative temperature coefficient for reverse breakdown, with value -0.34/spl plusmn/0.05 V/spl middot/K/sup -1/.
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GaN: Processing, defects, and devices
S. J. Pearton, J.C. Zolper, R. J. Shul et al. · Journal of Applied Physics · 1999 · 1.8K citations
High voltage (450 V) GaN Schottky rectifiers
Zvonimir Bandić, P. M. Bridger, E. C. Piquette et al. · Applied Physics Letters · 1999 · 153 citations
Electric breakdown in GaN <i>p-n</i> junctions
V. Dmitriev, K. G. Irvine, C. H. Carter et al. · Applied Physics Letters · 1996 · 114 citations