Relationship Between the Density Profile and the Technological Properties of the Particleboard Composite

Abstract

Particleboard is one of the most important wood-based panel products on the market. The objectives of this study are to investigate the relationship between the density profile and some technological properties of particleboard and to determine the influences of press type, cold and hot press pressures, moisture content of the raw materials on the mechanical properties (modulus of rupture, modulus of elasticity and internal bond strength), physical properties (thickness swelling and density profile), and surface property (surface roughness) of three-layered particleboard composite. Based on the findings of this study, it appears that there exists a relationship between the density profile and technological properties of particleboard. The press type, cold and hot press pressures and moisture content of the raw materials are significantly found to be effective on all of the properties of the panels.