Publication | Closed Access
MEMS packaging process by film transfer using an anti-adhesive layer
23
Citations
22
References
2010
Year
Advanced PackagingMaterials ScienceEngineeringAdvanced Packaging (Semiconductors)MicrofabricationMems Packaging ProcessChip AttachmentElectronic PackagingMicroelectronicsActive PackagingMicro-electromechanical System
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