Investigation of thermal conductivity of PCB

Abstract

The thermal conductivity of PCB structures variations according to the position of the metal layers as a function of the local copper contents and distribution are studied. The value of the parallel and serial thermal conductivity coefficient of PCB have been calculated by usage of the corresponding electrical analogs of parallel and serial resistive systems. Solutions were obtained for two PCB thicknesses. Cases with and without a copper layer on the component side were investigated. Simulated results are verified with infrared thermovision measurements.