Thick-film sensors: past, present and future

TLDR

Thick‑film sensors have evolved into a key enabling technology for solid‑state sensors, with widespread applications across mechanical, radiant, thermal, magnetic, and chemical domains and core features such as hybrid circuits, support structures, and primary sensing elements. This review examines the current state of thick‑film sensors and explores their future prospects amid rapid advances in sensor materials. The authors synthesize the evolution, applications, and technical characteristics of thick‑film sensors, illustrating how they serve as a foundational mechanism for solid‑state sensing.

Abstract

A review of thick-film sensors is presented. The evolution of the technology to a successful enabling mechanism for solid-state sensors is described. Many examples of applications in the major signal domains (mechanical, radiant, thermal, magnetic and chemical) are cited. The important characteristics of the technology relating to hybrid circuits, support structures and primary sensing elements are illustrated. The future of thick-film sensors is discussed in the light of the rapid development of new materials for sensors that have emerged over recent years.