Electronics Letters · 1990 · 10 citations · 0 references
EngineeringMaterials EngineeringMaterials ScienceSemiconductor MaterialsSurface EngineeringSurface ScienceChemical BondingCoatingsSemiconductor Device MaterialsSemiconductor InterfacesSilicon MaterialsWafer BondingDie-to-wafer BondingDirect Wafer BondingHydrophilic BondingOxidationSilicon NitrideSilicon WafersWafer-to-wafer BondingWet Oxidation
Direct bonding has been accomplished between silicon nitride coated wafers and both nitride coated and uncoated silicon wafers. Successful bonding occurred when the initial nitride was hydrophilic as deposited or the nitride surface is rendered hydrophilic by a wet oxidation process prior to bonding.