Applied Physics Letters · 1989 · 39 citations · 9 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsMetal-semiconductor ContactsSemiconductor Device MaterialsSemiconductor InterfacesSemiconductor PhysicsSemiconductor SurfacesSemiconductor Thin FilmsDeposition TechniquesDoped SemiconductorsDoping In Thin FilmsElectrolytesIonic Liquid ElectrolytesLaser Metal DepositionLiquid ElectrolytesSemiconductor Doping
Maskless deposition of gold and copper from electrolyte solutions onto n-doped semiconductors (GaAs, Si) is investigated. The metal deposits are found to have lateral dimensions of about 1 μm and are in barrier contact with the semiconductor. The proposed deposition mechanism is governed by the electric fields resulting from the Dember effect, the p-n junction, and the thermal emf.
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Laser enhanced electroplating and maskless pattern generation
R. J. von Gutfeld, E. E. Tynan, R. L. Melcher et al. · Applied Physics Letters · 1979 · 170 citations