Development of a novel adaptive lead-free solder containing reinforcements displaying the shape-memory effect

Ni4Ti3-precipitation during aging of NiTi shape memory alloys and its influence on martensitic phase transformations

Jafar Khalil‐Allafi, A. Dlouhý, Gunther Eggeler · Acta Materialia · 2002 · 696 citations

Natural Sciences, Materials Engineering, Materials Science +14

Engineering aspects of shape memory alloys

S. J. Savage · International Materials Reviews · 1991 · 476 citations

Natural Sciences, Materials Engineering, Materials Science +12

Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu6Sn5 reinforcements

Jeff Sigelko, S. Choi, K. N. Subramanian et al. · Journal of Electronic Materials · 1999 · 64 citations

Natural Sciences, Materials Engineering, Materials Science +12

Microstructural engineering of solders

K. N. Subramanian, Thomas R. Bieler, J. P. Lucas · Journal of Electronic Materials · 1999 · 58 citations

Natural Sciences, Materials Engineering, Materials Science +12

Computer Simulation of Thermo-Mechanical Fatigue of Solder Joints Including Microstructure Coarsening

P. L. Hacke, A.F. Sprecher, H. Conrad · Journal of Electronic Packaging · 1993 · 52 citations

Natural Sciences, Materials Engineering, Materials Science +17