Concepedia

Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu6Sn5 reinforcements

Jeff Sigelko, S. Choi, K. N. Subramanian, James P. Lucas, Thomas R. Bieler

Journal of Electronic Materials · 1999 · 64 citations · 3 references

DOI

Concepts

References

3

A viable tin-lead solder substitute: Sn-Ag-Cu

Chad M. Miller, Iver E. Anderson, Jack Smith · Journal of Electronic Materials · 1994 · 261 citations

, , +9

Effects of cooling rate on mechanical properties of near-eutectic tin-lead solder joints

Z. Mei, J. W. Morris, M. C. Shine et al. · Journal of Electronic Materials · 1991 · 74 citations

, , +12

Enhanced solder alloy performance by magnetic dispersions

M. McCormack, S. Jin, G. W. Kammlott · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1994 · 31 citations

, , +16