Concepedia

Microstructural engineering of solders

K. N. Subramanian, Thomas R. Bieler, J. P. Lucas

Journal of Electronic Materials · 1999 · 58 citations · 2 references

On this page

Concepts

References

Concepts

Natural SciencesMaterials EngineeringMaterials ScienceElectronic MaterialsMaterials CharacterizationMetallurgyAlloysMetalsMicrostructure - Property RelationshipsMicrostructure AnalysisMicrostructure ControlMicrostructure EvolutionMicrostructural EngineeringMicrostructure DevelopmentSoldering

References

2

A viable tin-lead solder substitute: Sn-Ag-Cu

Chad M. Miller, Iver E. Anderson, Jack Smith · Journal of Electronic Materials · 1994 · 261 citations

Natural Sciences, Materials Engineering, Materials Science +9

Enhanced solder alloy performance by magnetic dispersions

M. McCormack, S. Jin, G. W. Kammlott · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1994 · 31 citations

Natural Sciences, Materials Engineering, Materials Science +16