Stress Metrology : The challenge for the next generation of engineered wafers - Concepedia

Concepedia

Publication | Open Access

Stress Metrology : The challenge for the next generation of engineered wafers

DOI Full Paper Access

10

Citations

25

References

2004

Year

Antoine Tiberj, Vincent Paillard, C. Aulnette, Nicolas Daval, K.K. Bourdelle, Myriam Moreau, M. Kennard, Ian Cayrefourcq

MRS Proceedings

Materials ScienceNext GenerationEngineeringWafer Scale ProcessingEngineered WafersMicrofabricationStressStressstrain AnalysisStress MetrologyResidual StressElectronic PackagingMechanics Of MaterialsMetrologyHigh Strain Rate

References

	Year	Citations

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