AIP conference proceedings · 2012 · 12 citations · 0 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsPhase TransformationsSolid State PhysicsAdsorption At InterfacesIon ImplantationLaser PhysicsSemiconductor LasersSilicon MaterialsThermal Properties Of SemiconductorsDiffusion During AnnealingExcimer LasersIon Implantation EffectsIon Implantation SimulationLaser AnnealingLaser Pulse DurationSilicon AnnealingSilicon Impurities
In this work, we investigated four possible mechanisms which were candidates to explain the shape of boron profiles after ion implantation and melting excimer laser annealing in silicon. A laser with a wavelength of 308 nm and a pulse duration of ∼180 ns was used. To simulate this process, an existing model for the temperature and phase evolution was complemented with equations for the migration of dopants. Outdiffusion, thermodiffusion, segregation, and adsorption were investigated as possible mechanisms. As a result, we found that outdiffusion and segregation can be excluded as major mechanisms. Thermodiffusion as well as adsorption could both reproduce the build-up at low melt depths, but only adsorption the one at deeper melt depths. In both cases, ion beam mixing during SIMS measurement had to be taken into account to reproduce the measured profiles.