Publication | Closed Access
Thin films stress extraction using micromachined structures and wafer curvature measurements
84
Citations
8
References
2004
Year
Materials ScienceWafer Scale ProcessingEngineeringMicrofabricationApplied PhysicsCurvature MeasurementsStressstrain AnalysisSolid MechanicsThin Film Process TechnologyThin FilmsElectronic PackagingMicroelectronicsMechanics Of MaterialsThin Film ProcessingHigh Strain Rate
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