Wetting process and interfacial characteristic of Sn–3.0Ag–0.5Cu on different substrates at temperatures ranging from 503K to 673K

Lead-free Solders in Microelectronics

Mulugeta Abtew, Guna S Selvaduray · Materials Science and Engineering R Reports · 2000 · 1.9K citations

Electrical Engineering, Miniaturization, Engineering +6

Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging

Moon Gi Cho, Sung K. Kang, Da‐Yuan Shih et al. · Journal of Electronic Materials · 2007 · 138 citations

Materials Engineering, Materials Science, Chemical Engineering +13

Modeling reactive wetting

James A. Warren, W. J. Boettinger, Andrew R. Roosen · Acta Materialia · 1998 · 119 citations

Engineering, Fluid Mechanics, Numerical Simulation +5

First-principles investigation of the structural and electronic properties of Cu6−xNixSn5 (x=0, 1, 2) intermetallic compounds

Chun Yu, Junyan Liu, Hao Lü et al. · Intermetallics · 2007 · 112 citations

Materials Science, Inorganic Chemistry, Materials Engineering +8

Contact angle measurements of Sn-Ag and Sn-Cu lead-free solders on copper substrates

Viola L. Acoff · Journal of Electronic Materials · 2004 · 97 citations

Materials Science, Materials Engineering, Electrical Engineering +8