Electronics Letters · 2009 · 20 citations · 15 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsDevice CharacterizationIii-v SemiconductorsSemiconductor Device MaterialsWide Band Gap SemiconductorsWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsAluminum Gallium NitrideAluminum NitrideAluminum Nitride DevicesBreakdown VoltageBreakdown Voltage OptimizationGallium Nitride (Gan) MaterialsGallium Nitride Power Devices
The buffer layer in AlGaN channel HEMTs to suppress the off-state drain leakage current is investigated. By employing an AlN for the buffer layer in Al0.39Ga0.61N/Al0.16Ga0.84N HEMTs, the off-state drain leakage current was sufficiently suppressed and the breakdown voltage was enhanced. It was considered that employing the AlN for the buffer layer is important for extracting the superior material properties of the AlGaN in the channel layer.
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30-W/mm GaN HEMTs by Field Plate Optimization
Yifeng Wu, A. Saxler, M. Moore et al. · IEEE Electron Device Letters · 2004 · 1.1K citations