Concepedia

Interfacial fracture toughness measurements in microelectronic packages with different test setups on samples from production

I. Maus, H. Pape, Hasan Sadat Nabi, Michael Goroll, H. Preu, J. Keller, L.J. Ernst, B. Michel, Bernhard Wunderle

2012 · 10 citations · 7 references

DOI

Concepts

Abstract

Interfacial delamination has become one of the most important reliability issues in the microelectronic industry, and therefore more and more focus is set on related research.

References

7

Mixed-mode bending method for delamination testing

James R. Reeder, John H. Crews · AIAA Journal · 1990 · 578 citations · Full text

, , +17

The mixed-mode bending method for delamination testing

James Reeder, John H. Crews · 30th Structures, Structural Dynamics and Materials Conference · 1989 · 378 citations

, , +17

Nonlinear Analysis and Redesign of the Mixed-Mode Bending Delamination Test

James R. Reeder, Jr John H. Crews · NASA STI Repository (National Aeronautics and Space Administration) · 1991 · 88 citations · Full text

, , +17

Lifetime modelling for microsystems integration: from nano to systems

Bernhard Wunderle, B. Michel · Microsystem Technologies · 2009 · 60 citations

, , +12

Refinements to the Mixed-Mode Bending Test for Delamination Toughness

EA Armanios, RB Bucinell, DW Wilson et al. · Journal of Composites Technology and Research · 2003 · 58 citations · Full text

, , +15