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Vertical profile optimization for +400 GHz fMAX Si/SiGe:C HBTs
10
Citations
3
References
2010
Year
Unknown Venue
EngineeringSilicon On InsulatorSemiconductor DeviceElectromagnetic CompatibilityLayer ThicknessRf SemiconductorElectronic EngineeringComputational ElectromagneticsElectrical EngineeringHigh-frequency DeviceAntennaDouble-polysilicon SigeFinal SpikeVertical Profile OptimizationSemiconductor Device FabricationMillimeter Wave TechnologyMicroelectronicsMicrowave EngineeringApplied Physics
This paper summarizes the work carried out on the vertical profile of double-polysilicon SiGe:C HBTs to get f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">MAX</sub> above 400 GHz. The effects of the final spike annealing temperature, the emitter doping species, the base and collector doping levels and the Si capping layer thickness are presented and discussed.
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