Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate

Rapid formation of intermetallic compounds interdiffusion in the CuSn and NiSn systems

S. Bäder, W. Gust, H. Hieber · Acta Metallurgica et Materialia · 1995 · 221 citations

Natural Sciences, Materials Engineering, Materials Science +16

Three-dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu

H. K. Kim, H. K. Liou, K. N. Tu · Applied Physics Letters · 1995 · 193 citations

Natural Sciences, Materials Engineering, Materials Science +17

Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders

S. K. Kang, S. Purushothaman · Journal of Electronic Materials · 1996 · 162 citations

Natural Sciences, Materials Engineering, Materials Science +12

Growth kinetics of intermetallic phases at the liquid Sn and solid Ni interface

S. K. Kang, V. Ramachandran · Scripta Metallurgica · 1980 · 127 citations

Natural Sciences, Materials Engineering, Materials Science +17

Reactive isothermal solidification in the Ni–Sn system

David Gur · Acta Materialia · 1998 · 112 citations

Engineering, Materials Engineering, Materials Science +14