Effect of Ag addition on the corrosion properties of Sn‐based solder alloys

Abstract

Abstract Corrosion properties of three different Sn‐Ag lead free solder alloys have been investigated in 0.3 wt% Na 2 SO 4 solution as corrosive environment. As cast solder alloy was analyzed by X‐ray diffraction (XRD) and scanning electron microscopy (SEM). Volume fractions of the Ag 3 Sn in the solders were determined by image analysis technique. Pitting potential and corrosion potential for the alloys were determined by potentiodynamic tests. Electrochemical impedance spectroscopy (EIS) was carried out to measure the film and charge transfer resistance. Alloys with lower Ag content have been found as better corrosion resistance material.