Co-sputtered TiB2 as a diffusion barrier for advanced microelectronics with Cu metallization

Transition metals in silicon

Eicke R. Weber · Applied Physics A · 1983 · 1.2K citations

Materials Science, Engineering, Transition Metals +5

Material selection for hard coatings

H. Holleck · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1986 · 1.2K citations

Materials Science, Materials Engineering, Multicomponent Boride +12

Diffusion barriers in thin films

M.−A. Nicolet · Thin Solid Films · 1978 · 681 citations

Materials Science, Engineering, Diffusion Resistance +5

Advanced multilayer metallization schemes with copper as interconnection metal

S. P. Murarka, R.J. Gutmann, Alain E. Kaloyeros et al. · Thin Solid Films · 1993 · 245 citations

Materials Science, Materials Engineering, Engineering +5

Copper-Based Metallization in ULSI Structures: Part II: Is Cu Ahead of Its Time as an On-Chip Interconnect Material?

Jian Li, T. E. Seidel, Jim W. Mayer · MRS Bulletin · 1994 · 103 citations

Materials Engineering, Materials Science, Electromigration Technique +13