High yield four-point bend thin film adhesion testing techniques

Young's Modulus, Shear Modulus, and Poisson's Ratio in Silicon and Germanium

J. J. Wortman, Russell Evans · Journal of Applied Physics · 1965 · 1.3K citations

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Sandwich test specimens for measuring interface crack toughness

Zhigang Suo, John W. Hutchinson · Materials Science and Engineering A · 1989 · 432 citations

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Engineering, Interfacial Adhesion, Cu Conductor +17

The fracture energy of bimaterial interfaces

A.G. Evans, M. Rühle, B.J. Dalgleish et al. · Metallurgical Transactions A · 1990 · 285 citations

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