Ryan P. Birringer

Environmentally assisted debonding of copper/barrier interfaces

Ryan P. Birringer, Roey Shaviv, Paul R. Besser et al. · Acta Materialia · 2012 · 31 citations

Materials Science, Electromigration Technique, Interface Phenomenon +6

High yield four-point bend thin film adhesion testing techniques

Ryan P. Birringer, Paula J. Chidester, Reinhold H. Dauskardt · Engineering Fracture Mechanics · 2011 · 30 citations

Materials Science, Engineering, Microfabrication +6

Bilayer metal gate electrodes with tunable work function: Mechanism and proposed model

Ching-Huang Lu, G. Wong, Ryan P. Birringer et al. · Journal of Applied Physics · 2010 · 20 citations

Engineering, Silicon On Insulator, Semiconductor Device +16

Aluminum-Germanium eutectic bonding for 3D integration

Filip Crnogorac, Ryan P. Birringer, Reinhold H. Dauskardt et al. · 2009 · 16 citations

Materials Engineering, Materials Science, Low-temperature Aluminum-germanium +15

Low-temperature Al–Ge bonding for 3D integration

Filip Crnogorac, Fabian R. W. Pease, Ryan P. Birringer et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 2012 · 11 citations

Engineering, Optoelectronic Devices, Integrated Circuits +17