Effect of primary creep and plasticity in the modeling of thermal fatigue of SnPb and SnAgCu solder joints

Thermal Stress and Low Cycle Fatigue

S. S. Manson, Thomas J. Dolan · Journal of Applied Mechanics · 1966 · 727 citations · Full text

Natural Sciences, Materials Science, Physics +10

Visco‐plasticity—plasticity and creep in elastic solids—a unified numerical solution approach

O. C. Zienkiewicz, I. Cormeau · International Journal for Numerical Methods in Engineering · 1974 · 619 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Constitutive relations for tin-based solder joints

Robert Darveaux, K. Banerji · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1992 · 469 citations

Natural Sciences, Materials Engineering, Materials Science +17

Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation

Andreas Schubert, R. Dudek, E. Auerswald et al. · 2003 · 386 citations

Engineering, Materials Engineering, Materials Science +17

Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints

A. Syed · 2004 · 353 citations

Engineering, Materials Engineering, Materials Science +17