Publication | Closed Access
Fast phase transformation due to electromigration of 18μm microbumps in three-dimensional integrated-circuit integration
18
Citations
8
References
2014
Year
Electrical EngineeringThree-dimensional Integrated-circuit IntegrationEngineeringWafer Scale ProcessingAdvanced Packaging (Semiconductors)MicrofabricationNanoelectronicsElectromigration TechniqueFast Phase TransformationApplied PhysicsElectronic PackagingMicroelectronicsInterconnect (Integrated Circuits)Microfluidics
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