Publication | Closed Access
Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film
31
Citations
3
References
2004
Year
Materials ScienceChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Flexible ElectronicsMicrofabricationApplied PhysicsAnisotropic Conductive FilmChip AttachmentElectronic PackagingMicroelectronics
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