Journal of Applied Physics · 1955 · 29 citations · 7 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsDopingMetal-oxide-semiconductor Field-effect TransistorsP-n JunctionsSemiconductor Crystal GrowthSemiconductor Device MaterialsSilicon MaterialsGallium Nitride Crystal GrowthHeat DissipationJunction Field-effect TransistorsN-type DopingOhmic ConductionOhmic ContactsP-n Junction CharacteristicsSilicon
Silicon n-p-n junction transistors have been made from rate-grown single crystals. Using gallium and antimony as doping agents, single crystals of n-type silicon have been grown containing up to five p-regions from 0.0005 to 0.002 inches wide which are suitable for the production of transistors. The ohmic contact to the p-type base region was made by alloying an aluminum wire using techniques similar to those employed in the fabrication of aluminum-silicon diodes. The electrical evaluation of n-p-n transistors produced from these single crystals is described. Alphas in excess of 0.9 at −1 ma emitter current have been obtained, and collector saturation currents of 10−6ampere/cm2 are common. With base-layer widths of about 0.0005 inch, the alpha cutoff occurs at approximately 5 megacycles. The units (approximately 0.04×0.04×0.5 inches in size) have been operated at power levels in excess of 1.5 watts in air with no special provision for heat dissipation.
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Design Theory of Junction Transistors
J.M. Early · Bell System Technical Journal · 1953 · 108 citations