Carboxylate-Passivated Silver Nanoparticles and Their Application to Sintered Interconnection: A Replacement for High Temperature Lead-Rich Solders

Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

Yi Li, C.P. Wong · Materials Science and Engineering R Reports · 2006 · 701 citations

Materials Engineering, Advanced Packaging, Electrical Engineering +12

Surface‐enhanced Raman scattering (SERS) of 4‐mercaptobenzoic acid on silver and gold substrates

Agnieszka Michota, J. Bukowska · Journal of Raman Spectroscopy · 2002 · 585 citations

Engineering, Metal Nanoparticles, Surface-enhanced Raman Scattering +20

Metal–metal bonding process using Ag metallo-organic nanoparticles

Eiichi Ide, Shinji Angata, Akio Hirose et al. · Acta Materialia · 2005 · 492 citations

Materials Science, Engineering, Metal Nanoparticles +5

Thermal behavior of silver nanoparticles for low-temperature interconnect applications

Kyoung‐sik Moon, Hai Dong, Radenka Marić et al. · Journal of Electronic Materials · 2005 · 378 citations

Materials Science, Engineering, Nanomaterials +9

High-temperature lead-free solders: Properties and possibilities

Katsuaki Suganuma, Seongjun Kim, Keun‐Soo Kim · JOM · 2009 · 343 citations

Materials Science, Materials Engineering, Engineering +8