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Role of the impurities in production rates of radiation-induced defects in silicon materials and solar cells
61
Citations
22
References
2001
Year
Wide-bandgap SemiconductorBoron-doped SiEngineeringRadiation-induced DefectsSilicon On InsulatorDefect TolerancePhotovoltaicsSilicon MaterialsSemiconductorsIntroduction RatesRadiation ChemistrySemiconductor TechnologyPhysicsCrystalline DefectsIntrinsic ImpuritySingle Event EffectsGallium OxideDefect FormationProduction RatesDefect Introduction RatesNuclear AstrophysicsSilicon DebuggingNatural SciencesApplied PhysicsSolar Cell Materials
The present extensive systematic study of defect introduction rates as a function of boron, gallium, oxygen, and carbon concentrations by means of deep level transient spectroscopy has drawn a quite complete picture towards the identification of the dominant radiation-induced defects in Si. The radiation-induced defect EV+0.36 eV has been identified as Ci–Oi complexes. The absence of an EC−0.18 eV complex center in gallium-doped samples and the linear dependence of its introduction rates on both the boron and oxygen content fixed its identification as the Bi–Oi complex in boron-doped Si. One of the technologically important results of present study is that the gallium appears to strongly suppress the radiation induced defects, especially hole level EV+0.36 eV (Ci–Oi), which is thought to act as a recombination center as well as the dominant compensating center at EC−0.18 eV (Bi–Oi). As a result, the effects of lifetime degradation and carrier removal could be partially offset to higher radiation fluences by using Ga as a dopant instead of boron in Si space solar cells. The anneal out of the new hole level EV+0.18 eV in gallium-doped samples at around 350 °C, together with recovery of free carrier concentration, suggests that this level may act as a donor-like center which compensates free carrier concentration in gallium-doped Si.
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