Fault isolation in semiconductor product, process, physical and package failure analysis: Importance and overview - Concepedia

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Fault isolation in semiconductor product, process, physical and package failure analysis: Importance and overview

35

Citations

5

References

2011

Year

Jiann Min Chin, Vinod Narang, Xiaole Zhao, M.Y. Tay, Angeline Phoa, Venkat Ravikumar, Lwin Hnin, Soon Huat Lim, Chea Wei Teo, Syahirah Zulkifli,

Microelectronics Reliability

ReliabilityElectrical EngineeringReliability EngineeringEngineeringHardware ReliabilitySemiconductor ProductSystems EngineeringEngineering Failure AnalysisCircuit ReliabilityElectronic PackagingPackage Failure AnalysisMicroelectronicsFault IsolationPhysic Of FailureDevice Reliability

References

	Year	Citations

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