M.Y. Tay

Fault isolation in semiconductor product, process, physical and package failure analysis: Importance and overview

Jiann Min Chin, Vinod Narang, Xiaole Zhao et al. · Microelectronics Reliability · 2011 · 35 citations

Reliability, Electrical Engineering, Reliability Engineering +12

Advanced fault isolation technique using electro-optical terahertz pulse reflectometry

M.Y. Tay, L. Cao, Manasa Venkata et al. · 2012 · 15 citations

Engineering, Optical Testing, Eotpr Results +20

Flip-chip package soft failure analysis and case studies using time domain reflectometry

L. Cao, Loc V. Tran, Amogh Prabhu et al. · 2010 · 12 citations

Engineering, Hardware Security, Reliability Engineering +19

Lock-in thermography application in flip-chip packaging for short defect localization

M.Y. Tay, M.C. Tan, Wentao Qiu et al. · 2011 · 10 citations

Engineering, Fault Isolation Tool, Advanced Packaging (Semiconductors) +19