Deposition techniques for dielectric films on semiconductor devices

Abstract

Techniques for forming dielectric layers for fabricating semiconductor components are reviewed, including (1) low-pressure techniques: evaporation, sputtering, plasma deposition, and low-pressure CVD, (2) techniques operating at one atmosphere total pressure: thermal oxidation, chemical vapor deposition, anodization, electrophoresis, spin on, spray on, silk screening, and (3) a number of miscellaneous techniques: roller coating, offset printing, centrifugation–sedimentation, and transfer. The advantages and limitations of the methods are presented and typical applications are given. Novel applications of the technology to other-than-silicon semiconductor devices are outlined, and future trends in the technology are indicated.