High Si and Ge n-type doping of GaN doping - Limits and impact on stress

Abstract

We report on GaN n-type doping using silane, germane, and isobutylgermane as Si and Ge dopants, respectively. A significant increase in tensile stress during growth is observed for Si doped samples while this is not the case for Ge doping. In addition, Ge can be doped up to 2.9 × 1020 cm−3, while Si doping leads to 3-D growth already at concentrations around 1.9 × 1019 cm−3. The free carrier concentration was determined by Hall-effect measurements, crystal quality, and structural properties by x-ray diffraction measurements. Additionally, secondary ion mass spectroscopy and Raman measurements were performed demonstrating the high material quality of Ge doped samples.