Multiscale perspectives of interface delamination in microelectronic packaging applications

Abstract

With the increasing complexity and ongoing miniaturisation of microelectronic systems, reliability issues and their associated structural dimensions cross over from the microscale to the nanoscale. From this perspective, fracture of materials and material interfaces for microelectronic components is essentially a multiscale process. In this paper, interface delamination at the individual scales (atomistic, meso and micro) is considered, and specific analysis methods are discussed in order to compile understanding of contributions from each scale towards the macroscale response of an epoxy moulding compound. As will be addressed, the contributions from each scale can be applied to the next scale, and so the multiscale impact is derived sequentially rather than simultaneously in a single model. First, results on each scale are presented, considering the multilevel impact.