Sander Noijen - Concepedia

Author

Sander Noijen

Philips (Netherlands)

Also Known As

S P M Noijen, S. P. M. Noijen, S. P. M. Noijen *, S.P.M. Noijen, Sander Noijen, Sander P.M. Noijen

Publications

220

Citations

H-Index

Concepts

All Affiliations

Philips (Netherlands)Delft University of Technology Eindhoven University of Technology Philips (Finland)Applied Technologies (United States)

About

Sander Noijen is an author at Philips (Netherlands) specializing in engineering, mechanical engineering, and mechanics of materials.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	9	9	174
2	Materials Science	6	6	98
3	Electrical Engineering	4	4	46
4	Applied Physics	3	3	56
5	Materials Engineering	1	1	32

Sander Noijen

Publications

174

Citations

H-Index

Page 1

	Year	Citations
An observer-controller combination for a unicycle mobile robot Sander Noijen, Paul Lambrechts, Henk Nijmeijer International Journal of Control Robot KinematicsMotion ControlRobot ControlObserver-controller CombinationEngineering	2005	52
A numerical experimental approach for characterizing the elastic properties of thin films: application of nanocantilevers René H. Poelma, Hamed Sadeghian, Sander Noijen, Journal of Micromechanics and Microengineering Numerical Experimental ApproachEngineeringMicromechanicsMechanical EngineeringCu Thin Films	2011	32
Numerical prediction of failure paths at a roughened metal/polymer interface Sander Noijen, O. van der Sluis, P.H.M. Timmermans, Microelectronics Reliability Materials ScienceReliability EngineeringEngineeringMechanicsMechanical Engineering	2009	16
A semi-analytic method for crack kinking analysis at isotropic bi-material interfaces Sander Noijen, O. van der Sluis, P.H.M. Timmermans, Engineering Fracture Mechanics Materials ScienceSemi-analytic MethodEngineeringIsotropic Bi-material InterfacesMechanical Behavior	2011	15
Periodic excitation of a buckled beam using a higher order semianalytic approach Sander Noijen, N.J. Mallon, R.H.B. Fey, Nonlinear Dynamics EngineeringPhysicsMechanical EngineeringApplied PhysicsPeriodic Excitation	2007	13
Thermo-mechanical investigation of the reliability of embedded components in PCBs during processing and under bending loading Bilim Atli-Veltin, Huang Ling, Susan Zhao, EngineeringMechanical EngineeringThermo-mechanical InvestigationResidual StressStressstrain Analysis	2012	12
On the epoxy moulding compound aging effect on package reliability Sander Noijen, R.A.B. Engelen, Joerg Martens, Quality DeteriorationEpoxy Moulding CompoundShelf LifeEngineeringMechanical Engineering	2009	12
Multiscale perspectives of interface delamination in microelectronic packaging applications Nancy Iwamoto, O. Hölck, Sander Noijen Molecular Simulation Interface DelaminationEngineeringMechanical EngineeringMaterial SimulationMultiscale Material	2011	11
Fluid-electrostatic-mechanical modeling of the dynamic response of RF-MEMS capacitive switches J.A. Bielen, J. Stulemeijer, Deepak Ganjoo, EngineeringMechanical EngineeringDynamic ResponseMicroactuatorComputational Mechanics	2008	11

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