P.H.M. Timmermans - Concepedia

Author

P.H.M. Timmermans

Philips (Netherlands)

Also Known As

P H M Timmermans, P. H. M. Timmermans, P.H.M. Timmermans, Peter Timmermans

Publications

598

Citations

H-Index

Concepts

All Affiliations

Philips (Netherlands)Eindhoven University of Technology Applied Technologies (United States)Delft University of Technology IMEC

About

P.H.M. Timmermans is an author at Philips (Netherlands) specializing in engineering, mechanical engineering, and mechanics of materials.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	11	11	549
2	Applied Physics	3	3	109
3	Social Sciences	1	1	38
4	Biomedical Engineering	1	1	18
5	Electrical Engineering	1	1	74

P.H.M. Timmermans

Publications

549

Citations

H-Index

Page 1

	Year	Citations
The Influence of Intrinsic Strain Softening on Strain Localization in Polycarbonate: Modeling and Experimental Validation Leon E. Govaert, P.H.M. Timmermans, W.A.M. Brekelmans Journal of Engineering Materials and Technology EngineeringExperimental ValidationMechanical EngineeringSoft MatterMechanics Modeling	1999	248
Stretching-induced interconnect delamination in stretchable electronic circuits O. van der Sluis, Yu‐I Hsu, P.H.M. Timmermans, Journal of Physics D Applied Physics EngineeringMechanical EngineeringInterconnect (Integrated Circuits)Mechanics ModelingPeel Testing	2010	74
Copper–rubber interface delamination in stretchable electronics J.P.M. Hoefnagels, Jan Neggers, P.H.M. Timmermans, Scripta Materialia Materials ScienceCopper–rubber Interface DelaminationElectromigration TechniqueEngineeringFlexible Electronics	2010	46
Design and implementation of flexible and stretchable systems Mario González, Bart Vandevelde, Wim Christiaens, Microelectronics Reliability Industrial DesignEngineeringSoft RoboticsFlexible ElectronicsStretchable Systems	2011	38
Effect of a hard coat layer on buckle delamination of thin ITO layers on a compliant elasto-plastic substrate: An experimental–numerical approach O. van der Sluis, Amir Abdallah, P.C.P. Bouten, Engineering Fracture Mechanics Materials ScienceEngineeringMechanical BehaviorMechanicsThin Ito Layers	2011	31
Mechanical failure analysis of thin film transistor devices on steel and polyimide substrates for flexible display applications Y. Leterrier, A. Pinyol, Damien Gilliéron, Engineering Fracture Mechanics Mechanical Failure AnalysisEngineeringDisplay TechnologyFlexible ElectronicsMicrofabrication	2010	30
Analysis of the Three-Dimensional Delamination Behavior of Stretchable Electronics Applications O. van der Sluis, P.H.M. Timmermans, E.J.L. van der Zanden, Key engineering materials EngineeringMechanical EngineeringBiomedical EngineeringDelamination BehaviorFlexible Sensor	2009	18
Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics O. van der Sluis, R.A.B. Engelen, P.H.M. Timmermans, Microelectronics Reliability Numerical AnalysisEngineeringMechanical BehaviorMechanicsMulti-layered Flexible Electronics	2009	17
Numerical prediction of failure paths at a roughened metal/polymer interface Sander Noijen, O. van der Sluis, P.H.M. Timmermans, Microelectronics Reliability Materials ScienceReliability EngineeringEngineeringMechanicsMechanical Engineering	2009	16
Numerical and Experimental Study of Critical Roof Collapse Conditions in Soft Lithography M. Decré, P.H.M. Timmermans, O. van der Sluis, Langmuir EngineeringStructural CrashworthinessMechanical EngineeringStructural OptimizationSoft Matter	2005	16

Page 1