Nancy Iwamoto

Property trend analysis and simulations of adhesive formulation effects in the microelectronics packaging industry using molecular modeling

Nancy Iwamoto, J. Pedigo · 2002 · 23 citations

Food Packaging, Engineering, Mechanical Engineering +21

Understanding modulus trends in ultra low K dielectric materials through the use of molecular modeling

Nancy Iwamoto, L. Moro, B. Bedwell et al. · 2003 · 20 citations

Engineering, Nanoporous Material, Chemistry +16

Molecular Modeling as a Tool for Adhesive Performance Understanding

Nancy Iwamoto, J. Pedigo, A R Grieve et al. · MRS Proceedings · 1998 · 15 citations

Engineering, Adhesive Material, Mechanical Engineering +7

Simulation of particle compaction for conductive adhesives using discrete element modeling

G.G.W. Mustoe, Masami Nakagawa, X. Lin et al. · 2003 · 14 citations

Engineering, Mechanical Engineering, Material Simulation +19

New metal layers for integrated circuit manufacture: experimental and modeling studies

Nancy Iwamoto, Nguyen Tam Nguyen Truong, E. Lee · Thin Solid Films · 2004 · 14 citations

Materials Science, 3D Ic Architecture, Electrical Engineering +12