Electrode Temperature Effect in Narrow-Gap Reactive Ion Etching

Abstract

The SiO 2 etch characteristics were investigated using a narrow-gap reactive ion etching (RIE) apparatus. The etch rate was decreased and the selectivity to Si was increased when the upper electrode temperature was increased. However, the etch characteristics were independent of the absolute temperatures of the electrodes. This phenomenon can be explained in terms of the difference in the polymer deposition rate on walls that have different temperatures.