Concepedia

Investigation of thermal stability of Mo thin-films as the buffer layer and various Cu metallization as interconnection materials for thin film transistor–liquid crystal display applications

Yee‐Wen Yen, Yu‐Lin Kuo, Jianyu Chen, Chiapyng Lee, Chung-Yu Lee

Thin Solid Films · 2007 · 48 citations · 13 references

DOI

Concepts

References

13

Impact of floating gate dry etching on erase characteristics in NOR flash memory

W.H. Lee, Dongkyu Lee, Young-Ho Na et al. · IEEE Electron Device Letters · 2002 · 93 citations

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Diffusion barrier properties of TaC between Si and Cu

Junji Imahori, Takeo Oku, Masanori Murakami · Thin Solid Films · 1997 · 64 citations

, , +3

The Cu-Mo (Copper-Molybdenum) system

P. R. Subramanian, David E. Laughlin · Bulletin of Alloy Phase Diagrams · 1990 · 63 citations

, , +4

Sputter-deposited Mo and reactively sputter-deposited Mo-N films as barrier layers against Cu diffusion

Jui‐Chang Chuang, Shuo‐Lun Tu, Mao‐Chieh Chen · Thin Solid Films · 1999 · 60 citations

, , +9

Diffusion barrier performances of direct current sputter-deposited Mo and MoxN films between Cu and Si

Yue He, J.Y. Feng · Journal of Crystal Growth · 2003 · 37 citations

, , +7