Composite plating of Sn–Ag alloys for Pb-free soldering

Physicochemical properties of small metal particles in solution: "microelectrode" reactions, chemisorption, composite metal particles, and the atom-to-metal transition

A. Henglein · The Journal of Physical Chemistry · 1993 · 1.7K citations

Natural Sciences, Chemistry, Materials Science +10

Assembly of Phenylacetylene-Bridged Silver and Gold Nanoparticle Arrays

James P. Novak, Daniel L. Feldheim · Journal of the American Chemical Society · 2000 · 203 citations

Natural Sciences, Chemistry, Materials Science +13

Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization

Jihun Jang, D. R. Frear, T. Y. Lee et al. · Journal of Applied Physics · 2000 · 192 citations

Natural Sciences, Materials Engineering, Materials Science +14

Modern Solder Technology for Competitive Electronics Manufacturing

Jennie S. Hwang, Anthony J. Rafanelli · Journal of Electronic Packaging · 1997 · 113 citations · Full text

Engineering, Materials Engineering, Materials Science +11

Modern electro-plating

Henry Leffmann · Journal of the Franklin Institute · 1924 · 30 citations