Pad roughness variation and its effect on material removal profile in ceria-based CMP slurry - Concepedia

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Pad roughness variation and its effect on material removal profile in ceria-based CMP slurry

42

Citations

13

References

2007

Year

Boumyoung Park, Hyunseop Lee, Kihyun Park, Hyoungjae Kim, Haedo Jeong

Journal of Materials Processing Technology

Materials ScienceEngineeringPad Roughness VariationMechanical EngineeringCeria-based Cmp SlurryRecyclingMaterial Removal ProfileDewateringMineral ProcessingAbrasive Machining

References

	Year	Citations

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